1 update=8/14/2019 7:07:47 PM
23 RequireCourtyardDefinitions=0
24 ProhibitOverlappingCourtyards=1
28 MinMicroViaDiameter=0.3048
29 MinMicroViaDrill=0.127
40 SilkTextSizeThickness=0.15
46 CopperTextThickness=0.3
50 CourtyardLineWidth=0.05
54 OthersTextSizeThickness=0.15
57 SolderMaskClearance=0.051
58 SolderMaskMinWidth=0.25
59 SolderPasteClearance=0
101 [pcbnew/Layer.In10.Cu]
105 [pcbnew/Layer.In11.Cu]
109 [pcbnew/Layer.In12.Cu]
113 [pcbnew/Layer.In13.Cu]
117 [pcbnew/Layer.In14.Cu]
121 [pcbnew/Layer.In15.Cu]
125 [pcbnew/Layer.In16.Cu]
129 [pcbnew/Layer.In17.Cu]
133 [pcbnew/Layer.In18.Cu]
137 [pcbnew/Layer.In19.Cu]
141 [pcbnew/Layer.In20.Cu]
145 [pcbnew/Layer.In21.Cu]
149 [pcbnew/Layer.In22.Cu]
153 [pcbnew/Layer.In23.Cu]
157 [pcbnew/Layer.In24.Cu]
161 [pcbnew/Layer.In25.Cu]
165 [pcbnew/Layer.In26.Cu]
169 [pcbnew/Layer.In27.Cu]
173 [pcbnew/Layer.In28.Cu]
177 [pcbnew/Layer.In29.Cu]
181 [pcbnew/Layer.In30.Cu]
189 [pcbnew/Layer.B.Adhes]
191 [pcbnew/Layer.F.Adhes]
193 [pcbnew/Layer.B.Paste]
195 [pcbnew/Layer.F.Paste]
197 [pcbnew/Layer.B.SilkS]
199 [pcbnew/Layer.F.SilkS]
201 [pcbnew/Layer.B.Mask]
203 [pcbnew/Layer.F.Mask]
205 [pcbnew/Layer.Dwgs.User]
207 [pcbnew/Layer.Cmts.User]
209 [pcbnew/Layer.Eco1.User]
211 [pcbnew/Layer.Eco2.User]
213 [pcbnew/Layer.Edge.Cuts]
215 [pcbnew/Layer.Margin]
217 [pcbnew/Layer.B.CrtYd]
219 [pcbnew/Layer.F.CrtYd]
225 [pcbnew/Layer.Rescue]
228 [pcbnew/Netclasses/Default]
246 SpiceAjustPassiveValues=0
248 ERC_TestSimilarLabels=1